Lins, Dio Hans; Franke, Steffen (5 August 2022). Simulation of the temperature distribution in glued butt-joint timber connections In: 15th World Congress on Computational Mechanics (WCCM-XV) and 8th Asian Pacific Congress on Computational Mechanics (APCOM-VIII). Yokohama, Japan / Virtual. July 31 to August 5, 2022. 10.23967/wccm-apcom.2022.104
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The end-grain bonding of timber components with the Timber Structures 3.0 technology (TS3) is an emerging construction method in timber engineering. For onsite applications at low ambient temperatures down to 0 °C, it is being investigated numerically and experimentally if it’s possible to heat the butt-joint to above 17 °C during the curing process using a heating wire. The current research results show that this is basically possible.
Item Type: |
Conference or Workshop Item (Paper) |
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Division/Institute: |
School of Architecture, Wood and Civil Engineering School of Architecture, Wood and Civil Engineering > Institute for Timber Construction IHB School of Architecture, Wood and Civil Engineering > Institute for Timber Construction IHB > Timber Structures group FGH |
Name: |
Lins, Dio Hans and Franke, Steffen  0000-0003-2430-8491 |
Language: |
English |
Submitter: |
Dio Hans Lins |
Date Deposited: |
20 Sep 2024 12:14 |
Last Modified: |
20 Sep 2024 12:14 |
Publisher DOI: |
10.23967/wccm-apcom.2022.104 |
Related URLs: |
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ARBOR DOI: |
10.24451/arbor.22522 |
URI: |
https://arbor.bfh.ch/id/eprint/22522 |
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