Machining metals and silicon with GHz bursts: Surprising tremendous reduction of the specific removal rate for surface texturing applications

Hirsiger, Thomas; Gafner, Markus; Remund, Stefan M.; Chaja, Michalina W.; Urniezius, Aivaras; Butkus, Simas; Neuenschwander, Beat; Račiukaitis, Gediminas; Molpeceres, Carlos; Narazaki, Aiko; Qiao, Jie (2020). Machining metals and silicon with GHz bursts: Surprising tremendous reduction of the specific removal rate for surface texturing applications In: Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV (p. 27). SPIE 10.1117/12.2543948

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Bursts of 230 fs pulses with up to 25 pulses having a time spacing of 180 ps were applied to steel AISI304, copper DHP, brass and silicon in real surface texturing (milling) application by machining squares. The previously reported very high removal rates for GHz bursts could not be confirmed, on the contrary, the specific removal rate tremendously drops down to less than 10% for the metals and 25% for silicon when the number of pulses per burst is increased. This drop is fully in line with shielding effects already observed in case of MHz pulses and double pulse experiments. The increase of the number of pulses per burst directly goes with strongly increased melting effects which are assumed to additionally re-fill the already machined areas in this milling application. Calorimetric experiments show an increasing residual heat with higher number of pulses per burst. Further the removal rates of the GHz bursts directly follow the tendency of single pulses of identical duration. This fosters the hypothesis that in case of metals and silicon only melting and melt ejection lead to the high reported removal rates for GHz bursts in punching applications and that no additional "ablation cooling" effect is taking place.

Item Type:

Conference or Workshop Item (Paper)

Division/Institute:

School of Engineering and Computer Science > Institute for Surface Applied Laser, Phototonics and Surface Technologies ALPS

Name:

Hirsiger, Thomas;
Gafner, Markus;
Remund, Stefan M.;
Chaja, Michalina W.;
Urniezius, Aivaras;
Butkus, Simas;
Neuenschwander, Beat;
Račiukaitis, Gediminas;
Molpeceres, Carlos;
Narazaki, Aiko and
Qiao, Jie

Subjects:

Q Science > QC Physics

ISBN:

9781510632981

Publisher:

SPIE

Language:

English

Submitter:

Beat Neuenschwander

Date Deposited:

28 Apr 2020 13:18

Last Modified:

29 Sep 2021 08:40

Publisher DOI:

10.1117/12.2543948

Additional Information:

Copyright 2020 Society of Photo‑Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this publication for a fee or for commercial purposes, and modification of the contents of the publication are prohibited

ARBOR DOI:

10.24451/arbor.11707

URI:

https://arbor.bfh.ch/id/eprint/11707

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