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Remund, Stefan; Gafner, Markus; Chaja, Michalina; Urniežius, Aivaras; Butkus, Simas; Neuenschwander, Beat; Molpeceres, Carlos; Narazaki, Aiko; Qiao, Jie (2021). Comparison of ultrashort pulse laser ablation with GHz pulse bursts and MHz pulse bursts of metals, silicon, and dielectric materials In: Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI (p. 10). SPIE 10.1117/12.2583192
Neuenschwander, Beat; Remund, Stefan; Wildbolz, Christoph August; Chaja, Michalina; Molpeceres, Carlos; Narazaki, Aiko; Qiao, Jie (2021). Machining of [100], [110] and [111] oriented silicon with ultrashort laser pulses in the NIR In: Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI (p. 21). SPIE 10.1117/12.2582661
Chaja, MichalinA; Laporte, Gregoire; Cam, Peter; Remund, Stefan; Neuenschwander, Beat; Molpeceres, Carlos; Narazaki, Aiko; Qiao, Jie (2021). Ultra-short pulses at high average power in the Laser MicroJet In: Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI (p. 43). SPIE 10.1117/12.2585550
Hirsiger, Thomas; Gafner, Markus; Remund, Stefan M.; Chaja, Michalina W.; Urniezius, Aivaras; Butkus, Simas; Neuenschwander, Beat; Račiukaitis, Gediminas; Molpeceres, Carlos; Narazaki, Aiko; Qiao, Jie (2020). Machining metals and silicon with GHz bursts: Surprising tremendous reduction of the specific removal rate for surface texturing applications In: Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV (p. 27). SPIE 10.1117/12.2543948
