ENHANCING END-GRAIN BONDING OF TIMBER COMPONENTS UNDER LOW-TEMPERATURE CURING CONDITIONS

Timber Structures 3.0 (TS3) technology developed during the last 10 years represents an emerging method in timber engineering, focusing on end-grain bonding of timber components. For a wider application, this study investigates the effects of low curing temperatures on tensile strength of the bond and explores optimization strategies. Results indicate that low curing temperatures adversely affect mechanical properties, while using heated casting resin significantly improves bonding strength. The findings provide design-relevant tensile strength values and effective bonding strategies for low ambient temperatures.