Layering the Architecture of Digital Product Innovations: Firmware and Adapter Layers
Version
Published
Date Issued
2025-07-14
Author(s)
Type
Article
Language
English
Abstract
This study investigates how organizations layer their product architectures by embedding digital components into physical products. Drawing on a longitudinal case study of PrintCo—a desktop 3D printer firm—we show that layering a product architecture relies on creating adapter layers that facilitate connections among physical and digital components. To generate these adapter layers, PrintCo first parametrized physical components through firmware, making them controllable and addressable. PrintCo then arranged higher-order digital functionality via adapter layers that couple parametrized physical components with additional digital functionality. Based on these findings, we propose a theoretical model that explains how organizations layer product architectures, what the role of adapter layers is, and how the transformation of an organization’s product architecture progresses.
Publisher DOI
Journal or Serie
Journal of the Association for Information Systems
Journal or Serie
Journal of the Association for Information Systems
ISSN
1536-9323
Publisher URL
Organization
Volume
26
Issue
6
Publisher
AIS eLibrary
Submitter
Tumbas, Sanja
Citation apa
Lehmann, J., Hukal, P., Recker, J., & Tumbas, S. (2025). Layering the Architecture of Digital Product Innovations: Firmware and Adapter Layers. In Journal of the Association for Information Systems (Vol. 26, Issue 6). AIS eLibrary. https://doi.org/10.24451/arbor.12923
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