Analysis of failure rate prediction by using part stress method for printed circuit board assemblies in power electronics building block

In this paper, the reliability prediction of a power electronics building block (PEBB) printed circuit board assembly (PCBA) is performed using the Part Stress Method from the MIL-HDBK-217FN2 handbook. The breakdown of the predicted reliability with respect to circuit functional blocks is presented. Furthermore, different cases are shown, where the components with small or large failure rate dominate. Finally, the ANSI-VITA51.1 adjustments are applied and their influence on the reliability prediction results and their usage are discussed.