SystemC-AMS/MDVP-based modeling for the virtual prototyping of MEMS applications
Version
Published
Date Issued
2015
Author(s)
Type
Book Chapter
Language
English
Abstract
This paper aims at providing guidelines to select the right modeling style for MEMS simulation in order to perform system analysis. This paper presents how an application with micro-electro-mechanical system (MEMS) sensors controlled by software can be modeled and simulated at high abstraction level. The overall modeling and simulation methodology lies on the extensions of SystemC named SystemC AMS/MDVP. In order to illustrate our approach, a case study is presented which integrate three-axis MEMS containing an accelerometer, a gyroscope, a magnetometer, and its associated CPU. A special focus is put on the MEMS gyroscope.
ISBN
978-1-4799-8625-5
Publisher DOI
Conference
2015 Symposium on Design. Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Publisher
IEEE
Submitter
ServiceAccount
Citation apa
Cenni, F., Guillaume, O., Diaz-Nava, M., & Mähne, T. (2015). SystemC-AMS/MDVP-based modeling for the virtual prototyping of MEMS applications. 2015 Symposium on Design. Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE. https://doi.org/10.24451/arbor.7619
Note
Conference 27-30 April 2015 Montpellier, France
Print ISBN: 978-1-4799-8627-9
Print ISBN: 978-1-4799-8627-9
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