Influence of low curing temperatures on the strength development of end-grain bonded timber

The end-grain bonding of timber components with the Timber Structures 3.0 technology (TS3) is an emerging construction method in timber engineering for which various research projects are being conducted. For onsite applications, among other things, it is being investigated how low temperatures during the curing process affect the bonding. The current research results show that low curing temperatures have a negative impact on the mechanical properties of the bond. However, it also shows that low temperatures have a different effect on the pure casting resin strength (cohesion) than on the bonding strength (adhesion). It has turned out that the pure casting resin is neither the decisive factor for the tensile strength of the end-grain bonding nor for the curing time. Based on these findings, compensation measures for bonding at low temperatures can be determined and further research can be carried out.