Micro structuring of transparent materials with NIR ns-laser pulses

A current challenge in laser processing is high precision micromachining of transparent materials, e.g. to manufacture micro-optical elements. This can be achieved amongst others by using laser induced backside wet etching. Research has been done by several groups in the last years. Most of the published results were obtained by using UV excimer lasers. Our approach deals withthe implementation of the technique for NIR laser sources. We investigated the effects of different pulse widths and repetitionrates on laser induced back side wet etching for 1064nm wavelength and for different absorbers.