Influence of low curing temperatures on the strength development of end-grain bonded timber

Lins, Dio Hans; Franke, Steffen (22 June 2023). Influence of low curing temperatures on the strength development of end-grain bonded timber In: World Conference on Timber Engineering 2023 (WCTE2023): Proceedings (pp. 1299-1304). As, Norway: World Conference on Timber Engineering (WCTE 2023) 10.52202/069179-0177

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The end-grain bonding of timber components with the Timber Structures 3.0 technology (TS3) is an emerging construction method in timber engineering for which various research projects are being conducted. For onsite applications, among other things, it is being investigated how low temperatures during the curing process affect the bonding. The current research results show that low curing temperatures have a negative impact on the mechanical properties of the bond. However, it also shows that low temperatures have a different effect on the pure casting resin strength (cohesion) than on the bonding strength (adhesion). It has turned out that the pure casting resin is neither the decisive factor for the tensile strength of the end-grain bonding nor for the curing time. Based on these findings, compensation measures for bonding at low temperatures can be determined and further research can be carried out.

Item Type:	Conference or Workshop Item (Paper)
Division/Institute:	School of Architecture, Wood and Civil Engineering School of Architecture, Wood and Civil Engineering > Institute for Timber Construction IHB School of Architecture, Wood and Civil Engineering > Institute for Timber Construction IHB > Timber Structures group FGH
Name:	Lins, Dio Hans and Franke, Steffen0000-0003-2430-8491
ISBN:	978-1-7138-7329-7
Publisher:	World Conference on Timber Engineering (WCTE 2023)
Language:	English
Submitter:	Dio Hans Lins
Date Deposited:	20 Sep 2024 12:04
Last Modified:	20 Sep 2024 12:04
Publisher DOI:	10.52202/069179-0177
Related URLs:	Organisation
Uncontrolled Keywords:	Cross Laminated Timber, end-grain bonded timber, tensile strength, temperature effect
ARBOR DOI:	10.24451/arbor.22521
URI:	https://arbor.bfh.ch/id/eprint/22521