Analysis of failure rate prediction by using part stress method for printed circuit board assemblies in power electronics building block

Grinberg, Roman; Riedel, G.J.; Dalessandro, L.; Steimer, P.; Apeldoorn, O. (2012). Analysis of failure rate prediction by using part stress method for printed circuit board assemblies in power electronics building block In: 6th IET International Conference on Power Electronics, Machines and Drives (PEMD 2012) (D51-D51). IET 10.1049/cp.2012.0335

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In this paper, the reliability prediction of a power electronics building block (PEBB) printed circuit board assembly (PCBA) is performed using the Part Stress Method from the MIL-HDBK-217FN2 handbook. The breakdown of the predicted reliability with respect to circuit functional blocks is presented. Furthermore, different cases are shown, where the components with small or large failure rate dominate. Finally, the ANSI-VITA51.1 adjustments are applied and their influence on the reliability prediction results and their usage are discussed.

Item Type:

Conference or Workshop Item (Paper)

Division/Institute:

School of Engineering and Computer Science

Name:

Grinberg, Roman;
Riedel, G.J.;
Dalessandro, L.;
Steimer, P. and
Apeldoorn, O.

ISBN:

978-1-84919-616-1

Publisher:

IET

Language:

English

Submitter:

Dr Roman Grinberg

Date Deposited:

21 Sep 2021 11:33

Last Modified:

21 Sep 2021 11:33

Publisher DOI:

10.1049/cp.2012.0335

Related URLs:

URI:

https://arbor.bfh.ch/id/eprint/15424

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